Thank you for visiting our booth during Productronica 2021 in Munich! We hope your stay was successful and you could find answers and solutions that fit your needs. Our tradeshow team has been delighted by many inspiring conversations and exciting project ideas and all of us at Finetech are looking forward to working with you to bring your vision to life.

For almost three decades, Finetech has been supporting start-ups as well as global technology leaders in the development and manufacturing of innovative semiconductor products. For example, our high-accuracy die bonders are currently used to buildMEMS-based sensors and imaging sensors for a wide range of applications, 5G modules and optical transceivers for data communication, or power lasers for industrial and medical applications.

But we don't stop there. Our Prototype-to-Production approach ensures a seamless transfer of R&D processes to the production environment and automation of all assembly steps without additional development effort.

Below, find an overview of our product and application highlights we have presented during Productronica 2021.

We have listened carefully to our customers and created the the most powerful tool for lab & research - the FINEPLACER^® pico 2. A machine more efficient and ergonomic than ever and with unrivaled technological diversity for almost all assembly tasks in the semiconductor world..

At Productronica 2021 in Munich, we proudly presented the successor of the acclaimed multi-purpose bonder FINEPLACER^® pico. It is the perfect starting point to set up a cost-efficient and flexible product development and small-series production.

We also presented the automatic placement and assembly system FINEPLACER^® femto^blu which allows you to keep the versatility and precision of the processes developed on the FINEPLACER^® pico 2 and combine it with fully-automated handling steps and pattern recognition. Process parameters which have already been qualified on the development system can be further used on the automatic bonding platform, as their tools and modules share the same technical basis.

You can automate your placement and assembly processes in a fast and easy way. With a placement accuracy down to 2 µm @ 3σ the FINEPLACER^® femto^blu is geared toward the demanding requirements of silicon photonics, quantum technology applications, MEMS-based sensor production etc.