
We live in a connected world, where information and ideas travel at the speed of light. From the smallest brain cell to outer space – photonic technologies are deeply rooted in all areas of our lives. At the same time, some of the most challenging assembly applications we see are in the field of opto-electronics, since delicate photonic and opto-electronic devices typically require the highest placement accuracy and specific process know-how.
As a leading manufacturer of high-precision bonding equipment, we engage in many collaborations with transformative leaders - researchers, product developers and production managers - who are literally guiding the world to the enabling power of light. Their countless innovations allow us to live in a technology enabled world. For us as a company, it is a privilege to help them bring their visions to life.
On the occasion of the International Day of Photonics 2022, we applaud the photonics community by sharing one of our stories. This day reminds us of the strong bonds developed between companies that enhance the potential of light - sometimes by using the power of light.
The Power of Light
Laser Power by Convergent Photonics
Convergent Photonics from Torino, Italy, develops and distributes High Power Industrial Fiber Laser Solutions for material processing applications. We have supported them in the development of powerful multi-emitter modules right from the start and helped them to successfully bring the assembly process into production using automatic die bonder systems.
At the beginning of the cooperation, we supplied Convergent Photonics with their first R&D bonder for the in-house development of a power laser module, inclusing the complete implementation of the initial laser assemblies as well as the pilot production of the multi-emitter laser module.
In addition to implementing the application, the challenge was to transfer the production of multi-emitter laser modules to series production. For this purpose, Convergent Photonics opted for an automated FINEPLACER® die bonder. This allowed them to maintain the level of process reproducibility and accuracy they had achieved during the development stage, while being able to integrate the automatic handling required for series production.

Automatic Packaging of Single Diode Lasers and Multi-Emitter Laser Modules
Finetech supports high power fiber laser manufacturer Convergent Photonics to implement high-accuracy assembly processes for in-house developed high power diode pumps and to transfer them from prototyping into series production.
Later, the manufacturing process was made even more efficient with the help of a Finetech production platform. Now all work steps were divided between the machines. While development work continues on the R&D bonder, the automatic assembly of laser components onto the submounts is carried out on the automated FINEPLACER®. The automated production platform is used to assemble all CoCs into the laser module housing.
Reactive Soldering with Laser Activation
With the help of extensive analyses and evaluations, alternative assembly and bonding technologies for advanced multi-emitters were investigated. For example, we developed an automatic solution to utilize bonding via reactive multilayer systems (RMS) for packaging of CoS onto a heat sink (second- level packaging).
Reactive soldering by laser-activation of nanofoils allows for an instantaneously fast and localized soldering of mid-sized to large components into packages with high thermal mass. It is perfectly suited for automated multi-chip module assembly, where conventional soldering won’t be applicable.
Our Laser Activation Module is used to activate or ignite reactive materials such as preforms or nanofoils by a laser pulse. With that short pulse of less than one second, the ignition temperature is reached and a rapid reaction will heat the solder layers on the preform. This process does not require additional cooling. The control of the laser pulse is fully integrated in the IPM bonding process and profiles. An additional software allows for fine-tuning of the laser driver.
The Laser Activation Module is available for FINEPLACER® femto 2 and FINEPLACER® femto blu. Existing machines can be retrofitted if they feature a laser-safe housing with enhanced interlock and safety access functions.






