
Finetech to Strengthen its Presence in Japan
On August 1, 2014, Finetech has opened its third Sales and Support Center in Asia - Finetech Nippon Co., Ltd.
With this move, Finetech seeks to further step up sales, service and application activities throughout Japan and strengthen the company’s local presence and responsiveness.
Finetech Nippon will be directed by General Manager Mr. Kotaro Iida who is looking forward to the task:
"I am convinced that – with the long years of experience – Finetech is in the position to achieve great things in Japan. Many companies, mainly from the communications sector, are facing demanding laser, VCSEL/PD or FlipChip application during their product development. Supporting them in finding tailor-made and competitive application solutions is an exciting challenge. Other promising markets with lots of potential include the widely developed Japanese education and research landscape, medical technologies, automation and robotics."
Gunter Kürbis, CEO of the Finetech group, also thinks starting a base in Tokyo is the logical next step for this market:
"Due to the new branch we are now able to respond immediately to inquiries from Japan – a market who is growing more and more important to us. Also, we can provide better advice to new and existing customers and broaden our service offerings. This complies with our principles of establishing a close and long-term partnership with our customers. An approach which encompasses the joint evaluation of their application, finding a corresponding optimal machine solution and finally providing on-going support once the customers have our machines in productive use.”
Finetech develops and manufactures innovative equipment solutions for a variety of micro assembly and SMD rework applications. Due to their modular architecture, the manual, semi-automated and full-automatic systems offer maximum process flexibility. Typical fields of use range from R&D and prototyping (high accuracy, low volume) to fully-automated production environments with high yield.