In his interview with Nanoindustry, Thomas Müller talks about the peculiarities of the Russian market and provides an outlook into the...

As part of the co-operative project "Silicon Photonics Enabling Exascale Data Networks (SPEED)", Finetech handles the experimental assembly...

On March 10, we have held the International Micro Assembly Day, a one-day conference dedicated to advanced packaging and micro assembly.

At Productronica 2015, Finetech is presenting a broad portfolio of hot air rework solutions for the whole SMD spectrum. On booth #A4/181,...

At Productronica 2015, Finetech is presenting its newest bonding platform FINEPLACER^® femto 2 for the first time. The fully automatic system...

...at LASER WORLD of PHOTONICS Hall B3 booth 359.
Today's advanced packaging and bonding technologies for opto-electronic and photonic...