Record attendance at Micro Assembly Day 2016

A record number of more than 65 visitors from all over Europe took the opportunity to connect and actively share knowledge of a wide range of the latest technological trends and concepts. Notable speakers from industry and science brought their expertise with insights in current market applications.

The Micro Assembly Day traditionally covers a broad spectrum of topics. Some of the subjects tackled this year included bonding technologies for 3D Packaging, packaging for opto- and microelectronics, nanowire based IC and packaging, hybrid MEMS assembly for biomedical applications, micro-sized LED displays, laser assisted die bonding, precision vacuum die bonding, ACF bonding and sintering strategies with silver particle paste and foil.

Additionally, all visitors got a chance to join guided tours around our new production and development center with a unique first-hand experience of the FINEPLACER^® manufacturing facilities, application labs and tool production. As not all the questions could be covered in detail, many customers returned on Friday for individual machine hands-on and consultation sessions with Finetech application specialists and product managers.

We'd like to thank all participants and speakers for coming to Berlin and contributing to the event’s success. Hope to welcome you soon at further Finetech events!