New state-of-the art center expands R&D, production, and application and demonstration capabilities.

The assembly of complex 2.5D and 3D IC packages requires the highest placement accuracy. If these packages are being placed to wafers, the...

On August 1, 2014, Finetech has opened its third Sales and Support Center in Asia - Finetech Nippon Co., Ltd.

Georgia Tech Packaging Research Center has selected Finetech's semi-automatic FINEPLACER^® matrix bonder to demonstrate the first...

Today, Finetech GmbH & Co. KG celebrated the laying of the foundation stone for a state-of-the-art production and development center in...

As of now, Finetech will be represented in the Czech Republic and Slovakia by ABE.TEC, sro.